凯发产品

规格: Specification:
电压/Voltage 1.8V,3.3V
温度/Temperature -40℃ ~ 85℃/105℃
容量/Density 1Gb / 2Gb / 4Gb/ 8Gb/ 16Gb
封装/Package TSOP48,FBGA63,FBGA67
速度/Speed 20ns/25ns,30ns/45ns
线宽/Width x8/ x16

PPI NAND Flash

兼容传统的并行接口标准,高可靠性。可提供容量从1Gb到16G,1.8V / 3.3V两种电压,多种封装方式的产品,以满足不同应用场景。在网络通信,智能音箱,机顶盒等领域中广泛应用。

Dosilicon's PPI NAND Flash is designed with traditional parallel peripheral interface with high reliability. It provides capacities from 1Gb to 16Gb, two voltages (1.8V / 3.3V) and different package types compatible with various application scenarios. It is widely used in many fields such as network communication, AI speaker, STB, etc

Type Part Number Density Voltage Speed(MHz/CLK) Temp. Range PKG Type Datasheet

PPI NAND

FMND1G08S3D-IA

1Gb

1.8V

45ns

-40℃~85℃

TSOP 48(12x20mm)

FMND1G08S3D-ID

VFBGA 63(9x11mm)

FMND1G08S3D-IF

VFBGA 67(6.5x8mm)

FMND1G08S3D-IE VFBGA 48(6.5x5mm)

FMND1G08U3D-IA

3.3V

25ns

TSOP 48(12x20mm)

FMND1G08U3D-ID

VFBGA 63(9x11mm)

FMND1G08U3D-IF

VFBGA 67(6.5x8mm)

FMND2G08S3D-IA

2Gb

1.8V

45ns

TSOP 48(12x20mm)

FMND2G08S3D-ID

VFBGA 63(9x11mm)

FMND2G08S3D-IF

VFBGA 67(6.5x8mm)

DSND2G08S3E-IA

TSOP 48(12x20mm)

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DSND2G08S3E-ID

VFBGA 63(9x11mm)

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FMND2G08U3D-IA

3.3V

25ns

TSOP 48(12x20mm)

FMND2G08U3D-ID

VFBGA 63(9x11mm)

FMND2G08U3D-IF

VFBGA 67(6.5x8mm)

DSND2G08U3E-IA

TSOP 48(12x20mm)

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FMND4G08S3B-ID

4Gb

1.8V

30ns

VFBGA 63(9x11mm)

FMND4G08S3C-ID

VFBGA 63(9x11mm)

FMND4G08S3B-IA

TSOP 48(12x20mm)

FMND4G08S3C-IA

TSOP 48(12x20mm)

FMND4G08S3F-ID

VFBGA 63(9x11mm)

DSND4G08S3D-ID

VFBGA 63(9x11mm)

DSND4G08S3C-ID

45ns

VFBGA 63(9x11mm)

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DSND4G08S3C-IA

TSOP 48(12x20mm)

DSND4G08S3C-IF

VFBGA 67(6.5x8mm)

FMND4G08U3B-ID

3.3V

20ns

VFBGA 63(9x11mm)

FMND4G08U3C-ID

VFBGA 63(9x11mm)

FMND4G08U3B-IA

TSOP 48(12x20mm)

FMND4G08U3C-IA

TSOP 48(12x20mm)

DSND4G08U3D-ID

VFBGA 63(9x11mm)

DSND4G08U3C-ID

25ns

VFBGA 63(9x11mm)

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DSND4G08U3C-IA

TSOP 48(12x20mm)

DSND8G08S3M-ID

8Gb

1.8V

30ns

VFBGA 63(9x11mm)

DSND8G08S3N-ID

VFBGA 63(9x11mm)

DSND8G08S3Q-ID

VFBGA 63(9x11mm)

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DSND8G08S3F-ID

VFBGA 63(9x11mm)

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DSND8G08U3N-ID

3.3V

20ns

VFBGA 63(9x11mm)

DSND8G08U3N-IA

TSOP 48(12x20mm)

DSND8G08U3Q-ID

VFBGA 63(9x11mm)

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DSND8G08U3F-IA

TSOP 48(12x20mm)

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DSND6G08S3Q-ID 16Gb 1.8V 30ns VFBGA 63(9*11mm) Contact us

DSND6G08U3N-IA

3.3V

20ns

TSOP 48(12x20mm)

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FMND1G08U3D-JA

1Gb

3.3V

25ns

-40℃~105℃

TSOP 48(12x20mm)

FMND4G08S3B-A2D

4Gb

1.8V

45ns

VFBGA 63(9x11mm)

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FMND4G08U3F-A2D

3.3V

25ns

VFBGA 63(9x11mm)

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DSND8G08S3M-JD

8Gb

1.8V

45ns

VFBGA 63(9x11mm)

EMMC

DS55B08D3A2-EA

8GB

3.3V

200MHz

-25℃~85℃

FBGA 153(11.5x13x1.0mm)

DS55B32D5A1-EA

32GB

DS55B64D5A1-EA

64GB





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